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產品簡介：
Product introduction:
Leetop_LHR-D5241F是一款高性能整機，采用了Leetop_ B100載板設計，并搭載了強大的RDK X3模組，擁有高達5 Tops的推理算力。搭載4核ARM Cortex?A53處理器，為用戶提 供卓越的計算性能。支持可拆卸式外殼串口調試，適用于各種調 試場景。此外，Leetop_LHR-D5241F配備了4個USB 3.0接口和 2個USB 2.0接口，提供多樣化的外設連接選項，滿足各類場景的 使用需求。同時，它還提供主動散熱，滿足用戶的散熱需求。
Leetop_LHR-D5241F is a high-performance machine that adopts the Leetop_B100 carrier board design and is equipped with the powerful RDK X3 module, with an inference computing power of up to 5 Tops. Equipped with an 4-core ARM Cortex?A53 processor, it provides users with excellent computing performance. Supports detachable housing serial port debugging, suitable for various debugging scenarios. In addition, Leetop_LHR-D5241F is equipped with 4 USB 3.0 interfaces and 2 USB 2.0 interfaces, providing a variety of peripheral connection options to meet the needs of various scenarios. At the same time, it also provides active cooling to meet users’ cooling needs.
產品規格 ：
Product specification ：
| Project | Sp ecification |
| Module Compa tibility | RDK X3 Moudle |
| Displa y | 1x HDMI |
| Et hernet | 1x Gigabit Ethernet (10/100/1000) |
| USB | 4x USB 3.0 2x USB 2.0(1xDebug;1xMicro USB |
| Audio | 1x Audio jack |
| Camera | 3x CSI Camera |
| DC | Power interface |
| Input Voltage | 12V(MAX 35W) DC Input |
| Load capacity | Above 35W |
| Structure size | 116x88.7x44.6(mm) |
| Operating Temperature | -20℃-60℃ |
產品規格 Product specification：
處理器模塊 Processor module：
RDK X3 Moudle 主要包含四核Cortex?A53處理器、5Tops算力、最高4GB內存且支持4K@60幀視頻編解；主要接口包括 HDMI、千兆以太網、USB 3.0、USB2.0、MIPI CSI、UART Debug、TF 卡接口等。
模組搭載雙頻 2.4/5.0GHz 無線局域網和藍牙 4.2 模塊，單板上已具備 PCB 天線，同時也可以搭配外部天線套件使用，能夠實現無線連接，降低用戶開發和 測試成本，縮短上市時間。
RDK X3 Module 可選的板載 RAM 容量包括 2GB、4GB。
RDK X3 Moudle mainly includes a quad-core Cortex? A53 processor, 5Tops computing power, up to 4GB memory and supports 4K@60 frame video encoding and decoding; the main interfaces include HDMI, Gigabit Ethernet, USB 3.0, USB2.0, MIPI CSI, UART Debug, TF card interface, etc.
The module is equipped with dual-band 2.4/5.0GHz wireless LAN and Bluetooth 4.2 modules. The board already has a PCB antenna and can also be used with an external antenna kit to achieve wireless connections, reduce user development and testing costs, and shorten time to market.
The optional onboard RAM capacities of RDK X3 Module include 2GB and 4GB.
尺寸示意圖：
Dimensional diagram：
| 正視圖 Front view | 左視圖 Left view |
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| 俯視圖 Top view | 底部視圖 Bottom view |
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